DIE bonder pick and place 3D model
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DIE bonder pick and place 3D model
DIE bonder pick and place 3D model

Publication date: 2024-10-28

Buy DIE bonder pick and place 3D model

$2

License: Royalty Free No Ai

author:

caecosmos

All content related to this 3D asset—including renders, descriptions, and metadata — is credited to its original author, «caecosmos». CGhub does not claim copyright ownership over the content used.
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  • Description
  • Formats

This is a high-speed suction device used in chip bonding machines. It is a general high-precision motion mechanism that sucks chips from the wafer table and places them on the substrate!

OTHER (Other, filesize: 15.6 MB)

3D Model details

  • cgtrader Platform
  • Animated
  • Rigged
  • Ready for 3D Printing
  • VR / AR / Low-poly
  • PBR
  • Textures
  • Materials
  • UV Mapping
  • Polygons: 0
  • Vertices: 0
  • Geometry: Unknown

Tags

Die Wafer Pick Technology Industrial Machine Industrial machine
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